News Items - International Association of Packaging Research Institutes
| Fraunhofer to exhibit at interpack 2023 May 2023 is shaping up to be a busy time, with the IAPRI Members’ Conference in Mumbai at one end of the month, and at the other, the interpack packaging show in Düsseldorf, Germany – where Fraunhofer IVV will be among those demonstrating its latest technologies and capabilities. On the materials side, the research institute will be highlighting its fiber-based options, including systems and technologies which, it says, can reliably control the processing behavior of paper and alternative materials on high-speed equipment. This will include demonstrations of thermoformed fiber-based packaging in combination with embossing for strong point-of-sale impact, and the inclusion of functional barrier layers.  Any switch to alternative materials and recyclates can introduce new variables into any process. Alongside its other services, Fraunhofer IVV will be showing the benefits of its inline monitoring technologies, the specification of process parameters, and machine design tailored to specific needs, all backed up by on-site efficiency analysis. Among the latest developments Fraunhofer will be showing on the VDMA booth (Hall 4, Booth C54) will be virtual reality (VR) and AI applications. It is using VR for digital training, allowing staff to master processes such as machine changeovers without physical access to the line. At the show, visitors will be able to sample a training system for thermoforming equipment. Specialists will also be on-hand to discuss digitalization (including networked production and the industrial internet of things) and mobile digital cleaning devices, alongside other technologies. Published: 02/27/23 |